That’s where Real‑Time C Functions come into play providing a familiar programming language for advanced applications giving even greater flexibility and computational efficiency.

These capabilities, supported across ACS motion controllers, give machine builders the freedom to implement customized, high‑performance algorithms directly in C — executed deterministically within the controller’s real‑time environment. This unlocks new levels of performance, control sophistication, and IP protection that are simply not achievable with proprietary languages or traditional PLC‑style programming.

Why Real‑Time C Functions Matter

1. Execute Complex Algorithms at Deterministic Controller Cycle Rates

Real‑Time C Functions run inside the controller’s deterministic loop — even as fast as one controller cycle — enabling the implementation of advanced algorithms that must be evaluated with microsecond‑level precision. This is ideal for:

• High‑speed compensation
• Real‑time signal processing
• Complex machine logic
• Application‑specific control algorithms

These C‑based functions “can be executed on the controller in real‑time (e.g. 1 controller cycle),” ensuring no delay between computation and motion execution.

2. Combine Flexibility with the ACSPL+ Ecosystem

ACSPL+ already provides:

• Up to 10 kHz execution rates
• Up to 64 simultaneous real‑time buffers
• Easy motion/event synchronization
• User‑defined subroutines and interrupts

But when needed, ACSPL+ functions can seamlessly call C‑based functions for heavy‑duty computation or specialized routines. This highlights how engineers can “develop sophisticated algorithms efficiently with real-time C functions” and integrate them directly into ACSPL+ program flows.

This tight integration gives machine builders the best of both worlds:

• Rapid development using ACSPL+
• Maximum flexibility and computational efficiency using C

3. Accelerate Throughput with Custom Logic and Processing

Many high‑speed applications — such as laser processing, metrology, advanced packaging, and scanning systems — require per‑cycle decisions or corrections. Real‑Time C Functions allow engineers to embed application‑specific decision‑making and processing directly into the control loop.

These C functions can:

• Significantly increase process throughput
• Allow execution of “complex algorithms efficiently” directly in C
• Support rapid evaluation and debugging through ACS’s MMI Controller Simulator

By reducing the need for external controllers or host‑side computation, machines become faster, more deterministic, and more robust.

4. Protect Your Intellectual Property

Machine builders often view their algorithms as competitive differentiators. ACS supports this by providing IP protection, including:

• Encapsulation of C code
• Encryption of real‑time functions
• Optional password protection inside ACSPL+ programs

Real‑Time C Functions come with encapsulation + encryption = full IP protection, ensuring proprietary logic remains secure on customer machines. This is essential for OEMs deploying equipment across multiple regions and customers.

5. Develop and Test with Robust Simulation Tools

Both ACSPL+ and Real‑Time C Functions are fully supported by ACS’s MMI Controller Simulator environment. This lets developers:

• Test algorithms without hardware
• Validate real‑time execution behavior
• Debug safely and quickly
• Shorten development cycles

Putting It All Together: A More Capable Machine Architecture

Real‑Time C Functions expand what’s possible inside your ACS motion controller by enabling:

• Machine‑specific control loops
• Real‑time kinematics and transformation logic
• Filtering, compensation, and signal analysis
• Integrated process control unique to your domain

With the ability to combine these functions with ACSPL+’s multitasking environment, 10 kHz execution rates, and event‑synchronized motion, OEMs can build smarter, faster, and more flexible systems.

Conclusion

As machine performance requirements continue to escalate, the freedom to create deterministic, cycle‑accurate logic inside the controller becomes essential. ACS’s Real‑Time C Function support delivers exactly that: a powerful blend of speed, customization, and security — all within the trusted ACS motion control architecture.

Whether you’re optimizing throughput, integrating custom algorithms, or adding unique process intelligence, Real‑Time C Functions give you the tools to push machine capability to the next level.

The post The Familiarity and Flexibility of C Programming in ACS Controllers appeared first on ACS Motion Control.

Why Advanced Packaging Is Redefining Manufacturing

Advanced Packaging introduces new structural and process challenges that ripple across the entire semiconductor value chain. The move toward 2.5D, 3D, FOWLP, and FOPLP packaging reflects the industry’s need to deliver higher performance in smaller, more efficient designs. Today’s equipment must contend with:

• Smaller chiplets
• Thinner wafers/dies
• Finer pitches
• A higher number of pick‑and‑place points
• Increased connection densities
• More sensitive inspection and via‑creation processes

These challenges drive the need for faster, more accurate, and more flexible machine architectures—capabilities that motion control technology must enable.

Motion Control: The Backbone of Advanced Packaging Equipment

The brochure highlights ACS Motion Control’s approach to solving these next‑generation requirements through EtherCAT‑based motion controllers and servo drives engineered for virtually any packaging machine configuration.

1. Better Throughput

To keep up with tighter process windows and increased throughput demands, equipment builders require motion systems that can move faster and settle quicker.

ACS improves throughput using:

• Optimized motion profile generation
• Advanced tuning techniques
• Servo algorithms that mitigate noise and disturbances for faster processing

These benefits compound in high‑speed workflows such as die bonding, metrology, wafer inspection, and hybrid bonding.

2. Faster Development

The Controller Simulator allows developers to build and test applications without hardware, cutting weeks from development cycles. Optimized motion tools help teams reach performance targets faster, accelerating time‑to‑market.

3. Higher Accuracy

As packaging dimensions shrink, positioning accuracy becomes critical.

ACS motion solutions offer:

• Sub‑nanometer resolution via unique servo technology
• Precise force control for delicate bonding applications
• NanoPWM drive technology for ultra‑low noise and high positional stability

Such precision is vital for processes like hybrid bonding (D2D, D2W, W2W), probing, and atomic‑force microscopy.

4. Greater Flexibility

The EtherCAT platform supports:

• Scalable machine designs
• Any host programming language
• Any motor/mechanical configuration
• Diverse price‑to‑performance options

This flexibility allows OEMs to configure systems optimized for both high‑volume manufacturing and specialized advanced‑node processes.

Application Examples Highlight Market Momentum

Hybrid Bonding (D2D, D2W, W2W)

The brochure emphasizes that hybrid bonding requires exceptionally fast settling, precise force control, and sub‑nanometer alignment—capabilities supported by ServoBoost, MotionBoost, and NanoPWM technologies.

Inspection & Metrology

Smarter gantry control combined with advanced servo algorithms supports nanometer‑level positioning accuracy for wafer‑to‑inspection alignment. Noise‑mitigating drive technology ensures stability for sensitive optical systems.

Laser‑Based Via Creation (TGV/TSV)

The brochure calls out these synchronized motion‑plus‑laser workflows:

• XL SCAN integrates galvo and precision stages for maximum throughput and accuracy
• LCI synchronizes fixed‑beam lasers with high‑precision motion for tighter tolerances
• Segmented Motion (XSEG) maximizes throughput on laser processing platforms

Die, TCB, & LED Bonding

Fast, accurate force‑controlled Z‑axis motion enables reliable, high‑speed bonding with minimal risk of die damage.

Atomic Force Microscopy

Sub‑nanometer stability from NanoPWM drives enhances scanning repeatability and measurement fidelity.  

Smarter Motion = Competitive Advantage in Advanced Packaging

ACS Motion Control’s Value Proposition

Better Throughput + Higher Accuracy + Faster Development + Greater Flexibility = Smarter Motion. OEMs in the Advanced Packaging market rely on motion control innovations to overcome escalating design complexity, tighter tolerances, and accelerating production requirements. As chiplet‑based SiP architectures continue reshaping the semiconductor landscape, motion control becomes not just an enabling technology—but a critical differentiator for next‑generation packaging equipment.

The post Advanced Packaging Market: Unlocking the Next Era of Semiconductor Manufacturing with Advanced Motion Control appeared first on ACS Motion Control.

As Moore’s Law continues to slow at the transistor level, the semiconductor industry has shifted innovation “up the stack”—into advanced packaging. Technologies such as 2.5D and 3D integration, chiplets, hybrid bonding, fan‑out wafer-level packaging (FOWLP), and heterogeneous integration are now central to performance, power efficiency, and system scaling.

While much of the discussion around advanced packaging focuses on materials, interconnect density, and thermal management, an equally critical transformation is happening on the factory floor. Manufacturing processes are becoming dramatically more motion‑intensive, more precise, and more tightly synchronized than ever before.

This evolution is placing new and unprecedented demands on motion control systems, from nanometer-level accuracy to ultra-smooth force regulation and deterministic multi-axis coordination.

From Front-End Scaling to Back-End Precision

Traditional front-end wafer fabrication has long pushed the limits of precision motion—lithography, inspection, and metrology being the most obvious examples. Advanced packaging, however, brings those same precision requirements into back-end and mid-end processes, where motion systems historically tolerated looser tolerances.

Advanced packaging manufacturing now includes:

• Die-to-die (D2D), die-to-wafer (D2W), and wafer-to-wafer (W2W) bonding
• Thermal compression bonding  (TCB) and hybrid bonding
• High-density interposers and redistribution layers (RDL)
• Ultra-thin wafer handling and stacking
• Panel-level processing for higher throughput

Each of these processes introduces new motion challenges that differ fundamentally from conventional pick-and-place or wire bonding.

Key Motion Control Challenges in Advanced Packaging

1. Nanometer-Level Alignment Over Large Work Areas

Hybrid bonding and chiplet assembly require overlay accuracy well below 100 nm, often across large substrates or panels. This creates a difficult combination:

• Long travel ranges
• Ultra-high resolution
• Tight thermal and mechanical stability

Motion systems must maintain global accuracy, not just local repeatability. This drives demand for:

• High-resolution linear encoders
• Advanced error mapping and compensation
• Advanced multi-degree-of-freedom (multi-DOF) encoders and thermal compensation control algorithms
• Deterministic multi-axis synchronization

2. Force Control Becomes as Important as Position

In hybrid bonding and advanced die attach, excess force can destroy micro-bumps or copper pillars, while insufficient force leads to poor yield or electrical failure.

As a result, closed-loop force control is no longer optional—it is central to the process. Motion controllers must:

• Blend position, velocity, and force control seamlessly
• React in real time to contact events
• Maintain ultra-smooth force profiles during bonding and compression
• Support sensor fusion (load cells, strain gauges, vision feedback)

This represents a shift from “move and stop” motion profiles to continuous, adaptive motion behavior.

3. Coordinated Multi-Axis and Multi-Stage Motion

Advanced packaging tools increasingly rely on:

• Stacked motion stages (coarse + fine)
• Multiple gantries operating simultaneously
• Coordinated motion between wafer stages, bond heads, and inspection optics

These systems demand:

• Deterministic coordination across dozens of axes
• Sub-microsecond synchronization
• Advanced contouring and trajectory planning
• Minimal following error during complex motion paths

Any latency, jitter, or loss of determinism directly impacts yield.

4. Throughput vs. Precision: No Longer a Tradeoff

Historically, manufacturers accepted lower throughput to achieve higher precision. In advanced packaging, that tradeoff no longer works economically.

Equipment must now deliver:

• High acceleration and settling performance
• Short tact times
• Smooth motion to avoid vibration-induced defects
• Predictable cycle-to-cycle behavior

This is driving adoption of advanced servo algorithms, vibration suppression, feedforward control, and intelligent trajectory optimization—all at the controller level.

5. Ultra-Thin and Fragile Material Handling

Advanced packaging workflows often involve wafers thinned to 50 µm or less, or large glass panels with very low stiffness. Motion systems must:

• Minimize jerk and shock
• Support smooth, S-curve or higher-order motion profiles
• Actively suppress resonance
• Adapt motion parameters dynamically based on payload and process state

Here, motion smoothness is just as critical as raw accuracy.

Software and Architecture Shifts in Motion Control

The changes in manufacturing processes are also reshaping how motion control systems are architected.

Real-Time, Software-Defined Control

Advanced packaging equipment increasingly relies on:

• Advanced EtherCAT-based multi-axis motion controllers
• Deterministic real-time operating systems
• Tight integration with vision, metrology, and process control

This allows equipment designers to:

• Rapidly iterate process recipes
• Simulate motion behavior before hardware is finalized
• Tune control loops for specific bonding or alignment tasks

Simulation and Digital Twins

Given the cost of scrap and downtime, motion simulation is becoming essential. Controller-level simulators enable:

• Validation of multi-axis coordination
• Optimization of trajectories for throughput and smoothness
• Early detection of resonance or stability issues

For advanced packaging, this can significantly reduce time-to-yield.

What This Means for Motion Control Suppliers and OEMs

Advanced packaging is no longer a niche—it is a strategic battleground for semiconductor innovation. For motion control technology, this means:

• Precision alone is not enough: Controllers must combine accuracy, force control, determinism, and throughput optimization.
• Flexibility matters: Packaging technologies evolve quickly; motion platforms must adapt without complete redesign.
• Software differentiation is growing: Advanced algorithms, simulation tools, and open architectures are becoming key competitive advantages.

Motion control is no longer just an enabling subsystem—it is a process-critical technology that directly impacts yield, reliability, and cost.

Conclusion: Motion Control as a Yield Enabler

As semiconductor scaling moves beyond transistors and into packaging, manufacturing complexity is rising sharply. Advanced packaging technologies demand motion systems that are:

• More precise
• More responsive
• More synchronized
• More intelligent

In this environment, motion control is no longer hidden in the background. It sits at the heart of advanced packaging equipment—enabling the next generation of high-performance, heterogeneous semiconductor devices.

Read more in the ACS Advanced Packaging Brochure.

About ACS Motion Control ACS delivers advanced motion control solutions purpose‑built for semiconductor advanced packaging, helping manufacturers achieve higher throughput, greater accuracy, faster development, and more flexible machine designs. With industry‑leading servo algorithms, precise force and current control, scalable EtherCAT architectures, and powerful development tools, ACS enables reliable performance for increasingly complex SiP chiplet architectures, finer pitches, thinner wafers, and more demanding inspection and hybrid‑bonding applications.

The post Semiconductor Advanced Packaging appeared first on ACS Motion Control.

ACS Motion Control’s Laser Control Interface (LCI) directly addresses these pressures by delivering deterministic, position‑synchronized laser firing and power modulation across 2 to 5 axes. As laser processes evolve toward higher density, finer geometries, and complex multi‑axis coordination, LCI provides the trigger fidelity and temporal precision needed to keep pace with market demands.

Market Drivers: Finer Features, Higher Throughput, and Multi‑Axis Complexity

Across semiconductor and electronics manufacturing, the shift toward advanced packaging, micro‑interconnects, and heterogeneous integration demands increasingly fine laser features and higher process stability. Key laser‑processing application domains from your files include:

• TSV/TGV drilling, direct‑write lithography, and laser direct imaging, where consistent pulse placement and minimal thermal variation are critical.
• PCB/FPCB cutting and drilling, where multi‑layer stacks require precise depth control and synchronization between translational and rotational axes.
• OLED and micro‑LED fabrication, where uniform energy delivery prevents pixel‑edge damage at high process speeds.
• Glass, foil, and wafer micromachining, driven by consumer electronics miniaturization.

These applications increasingly involve multi‑axis contouring, complex spline‑based toolpaths, and smooth constant velocity throughout the entire process.

Why the LCI Matters: Deterministic Laser Firing at Sub‑Microsecond Latency

The LCI is designed specifically for position‑based and velocity‑dependent laser control, enabling precise energy placement even in high‑speed contour motion. Its capabilities include:

1. Sub‑microsecond latency

LCI delivers position‑based trigger outputs with extremely low latency and deterministic timing, ensuring each laser pulse aligns with the actual toolpath. This is crucial for multi‑axis processes where velocity can vary dramatically through corners or along spline paths.

2. Multiple laser‑activation modes for any contour

LCI supports a full suite of programmable modes:

• Fixed Distance Pulsing
• Segment‑Based Gating
• Coordinate Array Pulsing
• Distance Array Pulsing
• Coordinate Array Gating
• Distance Array Gating

These modes can also be combined internally for greater flexibility—an advantage for complex part geometries requiring selective pulsing or adaptive energy modulation.

View our LCI datasheet with the following examples and more.

3. Flexible power‑control formats

LCI offers PWM, analog, and digital power‑control outputs, enabling OEMs to interface with a wide range of industrial, UV, ultrafast, and fiber lasers. This versatility is essential given the market’s diversity of wavelength, pulse‑width, and power‑modulation requirements.

4. Consistency through speed variations

One of the persistent challenges in laser processing is scorching or over‑burning during speed drop‑offs (e.g., contour corners). LCI’s fixed‑distance pulsing maintains uniform spatial energy distribution, preventing damage even when axis velocities fluctuate.

Serving the Full Spectrum of High‑Demand Laser Markets

LCI’s feature set aligns directly with the needs of OEMs operating in:

• Semiconductor wafer processing (singe‑digit microns; TSV/TGV; interconnect drilling)
• OLED & micro‑LED display machining (thin‑film layers requiring ultra‑consistent energy)
• PCB/FPCB processing (multi‑layer, varied thickness materials)
• Automotive & aerospace components (precision metal cutting and welding)
• Biomedical device manufacturing (micro‑features and thin‑wall components)

As these industries push for more throughput and tighter tolerances, LCI provides the synchronization backbone that enables high‑speed, high‑density laser processing systems to scale.

Integrating Motion and Laser: LCI within the ACS Architecture

The LCI is part of ACS’s larger SPiiPlus motion‑control ecosystem, which combines:

• Universal servo drives supporting various motor and encoder types
• High‑bandwidth servo algorithms like ServoBoost for faster settling and reduced jitter
• Advanced profile‑generation tools such as XSEG and SmoothPath, enabling smooth, high‑speed contour execution with minimal error and reduced cycle times
• Real‑time programming via ACSPL+, ensuring deterministic coordination between motion profiles and laser events, even at 10 kHz program cycle rates

This architecture allows the LCI to operate not as an isolated laser trigger, but as an integrated, synchronous part of the motion system, ensuring that every pulse is placed exactly where the toolpath requires.

Conclusion: LCI as a Strategic Enabler in a Growing Market

The laser‑processing market’s trajectory is clear: higher density, more materials, tighter tolerances, and faster production cycles. ACS’s LCI directly aligns with these trends by offering:

• Deterministic, multi‑axis synchronized laser control
• Flexible pulsing and gating modes tailored for complex geometries
• Sub‑microsecond accuracy, crucial for modern sub‑micron processes
• Seamless integration with advanced trajectory generation and servo algorithms

As OEMs design next‑generation laser tools for semiconductor, electronics, display, biomedical, and industrial applications, LCI provides the synchronization precision and architectural flexibility needed to stay ahead of market demands.

The post Unlocking Consistent Quality in High‑Speed Contour Laser Processing appeared first on ACS Motion Control.

In automation of high volume production processes – every millisecond of cycle time matters. As precision stages move faster and accuracy demands tighten, traditional PID‑based control schemes often become the bottleneck. ACS Motion Control’s ServoBoost algorithm directly addresses this challenge, providing a quantum leap forward in servo performance that translates into higher throughput by decreasing overall move‑and‑settle times while increasing overall system stability.

ServoBoost Addresses Limitations to Improve Throughput

1. Reduces Move-and-Settle Time

ServoBoost’s advanced compensation algorithms analyze system errors in real time and applies optimal corrective actions at high frequency.

• Stages arrive at target positions sooner
• Process tools (cameras, lasers, probes) engage earlier
• Short-move sequences (e.g., inspection, die attach, scanning) achieve higher cycle rates

2. Minimizes Velocity Error for Higher Constant‑Velocity Performance

For scanning, imaging, and laser‑processing applications, constant velocity is critical. ServoBoost significantly reduces velocity ripple, yielding smoother motion and allowing higher feed rates without degrading process quality.

3. Enhances Stability Across Frequency Ranges

Traditional servo loops struggle with mechanical resonances — especially large‑format stages and tools with cantilevered masses. ServoBoost identifies these resonances and automatically attenuates them to minimize effects on the system.  Additionally, ServoBoost also integrates seamlessly with complementary ACS features like MotionBoost, SmoothPTP, and Input Shaping, which further reduce motion‑induced resonances to increase throughput.

4. Reduces the Need for Extensive Manual Tuning

OEMs frequently struggle with tuning consistency from prototype to production systems. ACS explicitly highlights that ServoBoost helps address variability in system performance and reduces the burden on engineering teams. This makes scaling production faster and more predictable.

5. Improves Stability in High-Duty-Cycle Applications

ServoBoost’s real-time correction ensures stable performance compensating for mechanical wear, and variable loads over time.

Red: Position error with standard servo algorithm Green: Position with ServoBoost

Conclusion: A Simple Upgrade with Significant Throughput Payoff

ServoBoost represents a major advancement in servo control performance, and because it is easily activated in ACS motion controllers and drives, OEMs can activate these benefits without mechanical redesign.

For machine builders pushing the limits of speed and precision, ServoBoost provides:

• Higher throughput
• Improved accuracy
• Reduced tuning time
• More consistent performance across machines

The post Boost Machine Throughput with ServoBoost: How Advanced Control Algorithms Deliver Results appeared first on ACS Motion Control.

What is the FRF Analyzer?

The FRF Analyzer is a sophisticated tool that measures and analyzes the dynamic behavior of your motion system in the frequency domain. By characterizing the relationship between input and output signals across a range of frequencies, engineers gain deep insights into system stability, resonance points, and bandwidth limitations.

This tool is indispensable for:

• Optimizing servo loop performance
• Identifying mechanical resonances
• Designing robust control strategies for complex multi-axis systems

Key Features and Capabilities

• Comprehensive Plot Options
  Visualize system dynamics using Bode, Nyquist, and Nichols diagrams for intuitive interpretation of gain and phase relationships.
• Design Mode for Rapid Optimization
  Adjust servo parameters in real time and immediately see the impact on system stability. Automatic identification of gain margins, phase margins, and modulus margins accelerates the tuning process.
• Cross-Coupling Analysis
  Evaluate interactions between axes to ensure coordinated motion in gantry systems and other multi-axis configurations.
• Auto-Tuning Integration
  Combine FRF analysis with ACS’s Smarter Autotuning for a streamlined workflow that minimizes manual effort while achieving superior performance. 
• Flexible Measurement Options
  Balance precision and speed with customizable excitation and duration settings, ensuring accurate results for both rigid and compliant systems.
• FRF Analyzer Host Application Library
  Integrate FRF Analyzer functionality into your own machine software interface

Why It Matters

In applications such as semiconductor inspection, laser micromachining, and precision metrology, every millisecond counts. Poorly tuned systems can lead to:

• Increased settling times
• Excessive vibration affecting critical process measurements
• Reduced throughput and accuracy

The FRF Analyzer helps engineers overcome these challenges by providing actionable insights and tools to fine-tune control loops for maximum stability and responsiveness.

Beyond Diagnostics: A Design Tool

Unlike traditional diagnostic utilities, the FRF Analyzer doubles as a design platform. Engineers can:

• Validate servo performance under varying loads and conditions
• Implement advanced filters and compensation strategies
• Standardize tuning across production systems without repetitive manual adjustments

Integrated into the SPiiPlus Ecosystem

The FRF Analyzer is part of the SPiiPlus ADK Suite, which also includes:

• 3D Scope for motion visualization
• Adjuster Wizard for step-by-step axis setup
• Controller Simulator to develop applications without hardware

Together, these tools provide a unified environment for developing, deploying, and maintaining high-performance motion control applications throughout the machine lifecycle.

Ready to Elevate Your Motion Control?

Explore how the FRF Analyzer can transform your system performance and unlock new levels of precision. Visit ACS Motion Control or contact our team for a demo.

The post Unlocking Precision: How the FRF Analyzer Maximizes Motion Control Performance appeared first on ACS Motion Control.

What Is the Controller Simulator?

The SPiiPlus Controller Simulator is part of the SPiiPlus Application Development Kit (ADK). It emulates a real ACS motion controller on a standard PC, supporting up to 128 axes and 64 simultaneous program buffers (or threads). This virtual environment allows engineers to:

• Develop & test ACSPL+ programs.
• Develop & test software applications using various host libraries (C/C++, C#, .NET, Python, MATLAB).
• Validate motion profiles and machine logic.
• Emulate machine inputs & fault conditions

By simulating various critical machine functions, the Controller Simulator enables faster development and lowers integration risks before hardware deployment.

Key Benefits

• Faster Development Cycles
  Start programming immediately—no need to wait for hardware availability.
• Risk Reduction
  Validate complex motion sequences and safety logic in a controlled environment.
• Flexible Field Support
  Minimize downtime by debugging application code remotely & quickly
• Cost Savings
  Eliminate the need for dedicated test systems or rigs.

Integration with ACS Capabilities & Features

The Controller Simulator works seamlessly with:

• MMI Application Studio for configuration.
• Scope and Diagnostics for real-time performance analysis.
• G-Code support to develop & debug CAD/CAM profiles
• PEG/MARK functionality to simulate motion-to-process synchronization events
• ACSPL+ Programming functions, logic and multi-threaded environment
• Real-Time C Programming function blocks for advanced application code

Ready to accelerate your motion control development?
Download the SPiiPlus ADK Suite and start using the Controller Simulator today.

 Learn More & Request a Demo
 Email: sales@acsmotioncontrol.com | support@acsmotioncontrol.com

The post Accelerate Development with the SPiiPlus Controller Simulator appeared first on ACS Motion Control.

What Is ACSPL+?

ACSPL+ is a powerful real-time programming language designed specifically for motion control systems. It supports up to 128 axes, executes programs at rates up to 10 kHz, and enables multi-tasking across 64 simultaneous buffers. Whether you’re building semiconductor inspection systems, laser micromachining platforms, or precision biomedical equipment, ACSPL+ provides the tools to meet demanding application requirements.

Key Features & Benefits of ACSPL+

1. Real-Time Performance > Maximize Throughput

ACSPL+ executes motion control code at up to 10 kHz in up to 64 multi-tasked buffers.  This enables machine designers to coordinate motion with real-world events and software user interfaces to maximize machine throughput and system responsiveness.

2. Advanced Programming Capabilities > Flexibility to Scale

• Combines object-oriented and scripting for powerful yet intuitive development.
• Supports user-defined functions in standard C for real-time execution.
• Includes algebra functions for kinematics and data processing.

3. Robust Controller Simulation Environment > Reduced Development Time

Develop and debug applications using a full controller simulator that emulates motion, I/O, events, & other logic.  This allows engineers to develop entire motion systems without hardware dependencies significantly reducing development time and allowing machine builders to bring next-generation equipment platforms to market faster.

4. Comprehensive & Backward Compatible > Re-usable Code Base

ACSPL+ includes a comprehensive command set for any and all motion control and machine control functions.  Its continuous evolution over 25+ years ensures long-term stability and compatibility—no code rewrites required.  Command set highlights:

• Axis management
• Advanced motion profiles:  MotionBoost, SmoothPath & more
• Motion-to-Event Synchronization: PEG, MARK, Position event generation (PEG)
• Advanced Servo Control algorithms
• and many more

5. High-Speed Data Collection > Improve Process Control

With Servo Processor Data Collection (SPDC), ACSPL+ enables fast sampling (up to 20 kHz) of critical motion system variables to machine events and improve process control.

6. Diagnostics and Preventive Maintenance > Reduce Downtime

Built-in tools help identify undesirable behaviors and generate maintenance indicators—reducing downtime and extending equipment life.

7. Password Protected > Secure IP Protection

Secure your application code and machine settings with password protection, ensuring safe access for developers and operators.

8. Seamless Integration with Host Applications > Programming Flexibility

ACSPL+ works seamlessly with host programming libraries across platforms including C/C++, .NET, Python, MATLAB, Linux, and MacOS. This flexibility allows engineers to integrate motion control functionality into broader machine architectures with ease.

ACSPL+: Designed for Precision Motion Control Systems

From laser processing to semiconductor metrology, ACSPL+ is engineered to handle complex, multi-axis motion with precision and reliability. Its continuous evolution over 25+ years ensures long-term stability, compatibility and a re-usable code base to quickly develop new advanced automation equipment.

The post Unlocking Performance & Flexibility with ACSPL+ appeared first on ACS Motion Control.

We recently spoke with Josh Shimchick, VP of Sales at Valin, to reflect on what makes our partnership thrive and where the future is headed.

A History of Innovation Together

Dynamic Solutions began integrating ACS controllers into applications as early as 2005, when semiconductor, life sciences, and electronics customers in Northern California needed performance that went beyond existing motion solutions. Josh recalls one of the earliest turning points:

“We had an LED scribing application that was struggling with tuning another controller. When we switched to ACS, it just worked. That success opened the door to wider adoption—and we’ve trusted ACS ever since.”

Why the Partnership Works

If Josh had to sum up the ACS – Valin partnership in one word, it would be bandwidth.

“ACS gives us the margin we need. Their controllers deliver performance we can replicate across systems, ensuring customers can scale reliably. It’s not just reliable, it’s the confidence that no matter how complex the application, we have the tools to succeed.”

That technical confidence is paired with people. Josh emphasizes that customers don’t just need a product, they need expertise.

“You can’t just buy an ACS controller online and be done. You need support, and that’s where the partnership shines. We’ve invested 20 years learning ACS, and with Eric Larson, Western Regional Sales Manager, and Dylan Kingsbury, Applications & Support Engineer, alongside us, customers know they’re covered.”

A Standout Project

Josh recalls a recent project where a customer, struggling with another controller, faced nanometer-level precision challenges. Within an hour, the team swapped in an ACS controller and exceeded the customer’s demanding specs — without any redesign.

“That moment really showed the power of ACS. The customer was relieved to know their system design was sound—they just needed the right controller.”

Looking Ahead

The future is bright. As automation, AI, and advanced manufacturing evolve, demands for higher precision and faster performance will only grow. Josh sees opportunities especially in life sciences, semiconductor packaging, and advanced research.

“The applications are only getting more precise. With ACS’s toolsets and ongoing product innovation, we’re ready to meet that demand together.”

From Dynamic Solutions to Valin, and now as part of the Graybar family, the partnership with ACS Motion Control has stood the test of time. Together, we’re not just delivering motion solutions, we’re building the future of precision automation.

The post Celebrating Partnership: Valin Corporation and ACS Motion Control appeared first on ACS Motion Control.

From the outset, SanTech recognized ACS as a partner that is both “stable and reliable,” even amid global disruptions. The SanTech team praised ACS’s ability to maintain delivery and support, and highlighted ACS’s deep technical expertise and professionalism.

One standout moment in their collaboration was the development of a specially customized autofocus algorithm for a demanding application. ACS provided comprehensive testing details and manuals, which significantly reduced local deployment time. Another milestone was the joint effort to test and refine five-axis machining capabilities. “The ACS engineers demonstrated an extremely efficient and professional ability to solve problems. They were also very patient in explaining the issues we encountered. This has greatly enhanced our confidence in promoting the application of 5-axis machining.”

The partnership has delivered measurable business impact. ACS’s gantry solution helped SanTech outperform competitors in the laser processing field, securing key local orders. The introduction of products like UDMsm streamlined inventory and reduced SKUs, while the five-axis processing function shortened R&D cycles and costs.

Looking ahead, SanTech is excited to explore new frontiers with ACS, including advanced packaging in semiconductors and AI-driven machining systems. As one team member put it, “ACS is a globally renowned leading brand of high-end motion controllers. It will significantly enhance the motion control performance of your equipment.”

This partnership is more than technical—it’s personal. The friendship between ACS China engineers and the SanTech team extends beyond work, underscoring the trust and camaraderie that define their collaboration. It is this type of partnership that inspired our vision: “Smarter motion control solutions, through long-term partnerships, making life changing innovations possible.”

The post SanTech and ACS: A Partnership Built on Precision and Progress appeared first on ACS Motion Control.